The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Aug. 12, 2019
Applicant:

Semes Co., Ltd., Chungcheongnam-do, KR;

Inventors:

Kyung Sik Shin, Chungcheongnam-do, KR;

Man Kyu Kang, Chungcheongnam-do, KR;

Jun Ho Kim, Gyeonggi-do, KR;

Assignee:

Semes Co., Ltd., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); B25B 11/00 (2006.01); H05B 3/26 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); B25B 11/005 (2013.01); H01L 21/68707 (2013.01); H01L 21/68742 (2013.01); H05B 3/26 (2013.01); H05B 2203/002 (2013.01); H05B 2203/017 (2013.01);
Abstract

A hot plate in which holes are formed in proximity pins. The holes of the proximity pins are connected to vacuum holes to suppress generation of air flow during substrate heat treatment. A substrate heat-treating apparatus including the hot plate, and a method of fabricating the hot plate. The hot plate includes: a body with a heater; a plurality of first holes pass through the body in a downward direction; a plurality of proximity pins formed on the body support the substrate such that the substrate does not contact the top of the body. A plurality of second holes formed in at least some of the proximity pins and pass through the proximity pins in the downward direction from surfaces of the proximity pins. The first and second holes are connected to each other, and a vacuum is created inside the first and second holes to fix the substrate.


Find Patent Forward Citations

Loading…