The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Jul. 19, 2021
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Syouta Ikebe, Nagaokakyo, JP;
Yasuhiro Nishisaka, Nagaokakyo, JP;
Takefumi Takahashi, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/08 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/085 (2013.01); H01G 4/1218 (2013.01);
Abstract
A multilayer ceramic electronic component includes a multilayer body and an outer electrode on each end surfaces of the multilayer body. The outer electrode includes an underlying electrode layer and a plating layer on the underlying electrode layer. Void portions inside the underlying electrode layer are each filled with a barrier film. The barrier film is formed by an atomic layer deposition method.