The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
May. 20, 2020
Applicant:
3d Hubs B.v., Amsterdam, NL;
Inventor:
Eelco Hoogendoorn, Amsterdam, NL;
Assignee:
3D Hubs B.V., Amsterdam, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 119/08 (2020.01); G06F 111/10 (2020.01); G06F 119/18 (2020.01); G06F 30/12 (2020.01);
U.S. Cl.
CPC ...
G06F 30/12 (2020.01); G06F 2111/10 (2020.01); G06F 2119/08 (2020.01); G06F 2119/18 (2020.01);
Abstract
A computer-implemented method, computer program, system and apparatus for computing a thermal thickness and providing pre-manufacturing feedback on a design of a three-dimensional physical object that is to be formed by solidification of a fluid in a mold. An equation is solved, representing heat release through the cavity-mold interface when the object is formed. The thermal thickness and its uniformity provide insight in the manufacturability of the object, and may be used to automatically generate pre-manufacturing feedback. The thermal thickness and pre-manufacturing feedback are transmitted or displayed to a user.