The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Jul. 01, 2021
Beijing Institute of Technology, Beijing, CN;
Chunguang Xu, Beijing, CN;
Lei He, Beijing, CN;
Dingguo Xiao, Beijing, CN;
Qiutao Wang, Beijing, CN;
BEIJING INSTITUTE OF TECHNOLOGY, Beijing, CN;
Abstract
An ultrasonic detection and tensile calibration test method for bonding strength grade comprising bonding an upper substrate block to bonding groove(s) to form a theoretical bonding area, and applying a downward actual tensile force to a lower substrate block; obtaining an actual bonding area of the theoretical bonding area; calculating a first actual bonding strength by using the actual tensile force and the actual bonding area, and comparing the first actual bonding strength with a second actual bonding strength calculated to verify the correctness of the theoretical bonding area as a calibrated bonding strength; forming a bond strength table in which the theoretical bonding areas, the actual bonding areas and the first actual bonding strengths are in one-to-one correspondence; and using the actual bonding area to find the actual bonding strength corresponding to the actual bonding area from the bonding area bonding strength table.