The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Mar. 02, 2022
Applicant:

Aic Inc., Taoyuan, TW;

Inventors:

Yen-Chih Chen, Taoyuan, TW;

Hsih-Ting You, Taoyuan, TW;

Chi-Fu Chen, Taoyuan, TW;

Wei-Ta Chen, Taoyuan, TW;

Chien-Yang Lin, Taoyuan, TW;

Assignee:

AIC INC., Taoyuan, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 3/06 (2006.01); F28D 15/02 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28F 3/06 (2013.01); F28D 15/025 (2013.01); F28D 15/0266 (2013.01); F28D 15/0275 (2013.01); F28D 2021/0029 (2013.01);
Abstract

A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.


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