The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Oct. 24, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Vishwas Kumar Pandey, Madhya Pradesh, IN;

Eric Kihara Shono, San Mateo, CA (US);

Kartik Shah, Saratoga, CA (US);

Christopher S. Olsen, Fremont, CA (US);

Agus Sofian Tjandra, Milpitas, CA (US);

Tobin Kaufman-Osborn, Sunnyvale, CA (US);

Taewan Kim, San Jose, CA (US);

Hansel Lo, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/452 (2006.01); C23C 16/455 (2006.01); B01F 23/10 (2022.01); B01F 25/421 (2022.01); H01J 37/32 (2006.01); B01F 25/10 (2022.01); B01F 25/314 (2022.01); B01F 35/511 (2022.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/452 (2013.01); B01F 23/10 (2022.01); B01F 23/19 (2022.01); B01F 25/102 (2022.01); B01F 25/3141 (2022.01); B01F 25/31423 (2022.01); B01F 25/421 (2022.01); B01F 35/511 (2022.01); C23C 16/45536 (2013.01); C23C 16/45548 (2013.01); C23C 16/45561 (2013.01); H01J 37/3244 (2013.01); H01J 37/32357 (2013.01); H01L 21/67017 (2013.01);
Abstract

The present disclosure generally provides methods of providing at least metastable radical molecular species and/or radical atomic species to a processing volume of a process chamber during an electronic device fabrication process, and apparatus related thereto. In one embodiment, the apparatus is a gas injection assembly disposed between a remote plasma source and a process chamber. The gas injection assembly includes a body, a dielectric liner disposed in the body that defines a gas mixing volume, a first flange to couple the gas injection assembly to a process chamber, and a second flange to couple the gas injection assembly to the remote plasma source. The gas injection assembly further includes one or more gas injection ports formed through the body and the liner.


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