The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Nov. 09, 2021
Applicant:
Ddp Specialty Electronic Materials Us, Llc, Wilmington, DE (US);
Inventors:
Huide D. Zhu, Auburn Hills, MI (US);
Daniel P. Sophiea, Auburn Hills, MI (US);
Andrew R. Kneisel, Auburn Hills, MI (US);
Matthew B. Feldpausch, Auburn Hills, MI (US);
Susan P. Sevidal, Auburn Hills, MI (US);
Assignee:
DDP SPECIALTY ELECTRONIC MATERIALS US, LLC, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/04 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C08K 3/04 (2006.01); C08K 5/5415 (2006.01);
U.S. Cl.
CPC ...
C09J 175/04 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C08K 3/04 (2013.01); C08K 5/5415 (2013.01); C09J 2301/312 (2020.08);
Abstract
Moisture-curable, one component adhesives contain an isocyanate-terminated prepolymer, a low molecular weight polyisocyanate compound, a hydrolysable mercaptosilane, a urethane catalyst and a carbon black filler. The adhesives exhibit an excellent combination of high modulus, excellent hydrolytic and heat stability, and high sag resistance.