The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Oct. 28, 2021
Applicant:

Dexerials Corporation, Shimotsuke, JP;

Inventors:

Yasushi Akutsu, Utsunomiya, JP;

Reiji Tsukao, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/013 (2018.01); C08J 3/20 (2006.01); C08J 5/18 (2006.01); B32B 5/16 (2006.01); B32B 27/20 (2006.01); H01R 11/01 (2006.01); C08K 7/16 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); B29C 59/02 (2006.01); B29C 70/64 (2006.01); C08K 5/00 (2006.01); C08K 7/00 (2006.01); B29L 7/00 (2006.01); C09J 9/02 (2006.01); H01B 5/16 (2006.01); C09J 7/10 (2018.01);
U.S. Cl.
CPC ...
C08K 3/013 (2018.01); B29C 59/02 (2013.01); B29C 70/64 (2013.01); B32B 27/20 (2013.01); C08J 3/20 (2013.01); C08J 5/18 (2013.01); C08K 5/00 (2013.01); C08K 7/00 (2013.01); C08K 7/16 (2013.01); H01L 24/29 (2013.01); H05K 3/323 (2013.01); B29C 2059/028 (2013.01); B29K 2905/08 (2013.01); B29L 2007/008 (2013.01); B32B 5/16 (2013.01); B32B 2264/02 (2013.01); B32B 2264/105 (2013.01); B32B 2264/107 (2013.01); B32B 2264/202 (2020.08); B32B 2264/302 (2020.08); B32B 2264/303 (2020.08); B32B 2264/305 (2020.08); B32B 2264/403 (2020.08); B32B 2264/501 (2020.08); B32B 2264/504 (2020.08); B32B 2307/202 (2013.01); B32B 2405/00 (2013.01); B32B 2457/00 (2013.01); C08J 2333/10 (2013.01); C08J 2371/12 (2013.01); C08J 2463/00 (2013.01); C08K 2201/001 (2013.01); C09J 7/10 (2018.01); C09J 9/02 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2301/412 (2020.08); H01B 5/16 (2013.01); H01L 2924/07811 (2013.01); H01R 11/01 (2013.01); Y10S 428/906 (2013.01); Y10T 428/24521 (2015.01); Y10T 428/24545 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/25 (2015.01); Y10T 428/252 (2015.01); Y10T 428/254 (2015.01); Y10T 428/256 (2015.01); Y10T 428/28 (2015.01);
Abstract

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.


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