The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Jan. 21, 2021
Polypropylene-based resin expanded beads and polypropylene-based resin expanded beads molded article
Applicant:
Jsp Corporation, Tokyo, JP;
Inventors:
Tomohito Shimada, Utsunomiya, JP;
Hajime Ohta, Utsunomiya, JP;
Assignee:
JSP CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/16 (2006.01); C08J 9/224 (2006.01); C08J 9/16 (2006.01); B32B 1/00 (2006.01); B32B 5/18 (2006.01); B32B 27/06 (2006.01); B32B 27/32 (2006.01); C08J 9/228 (2006.01);
U.S. Cl.
CPC ...
C08J 9/16 (2013.01); B32B 1/00 (2013.01); B32B 5/18 (2013.01); B32B 27/065 (2013.01); B32B 27/32 (2013.01); C08J 9/224 (2013.01); C08J 9/228 (2013.01); B32B 2266/025 (2013.01); B32B 2307/72 (2013.01); C08J 2323/12 (2013.01); C08J 2423/12 (2013.01);
Abstract
An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.