The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Jun. 15, 2018
Applicant:

Ddp Specialty Electronics Materials Us, Llc, Wilmington, DE (US);

Inventors:

Stefan Schmatloch, Freienbach, CH;

Ilona Caderas, Freienbach, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/08 (2006.01); C08G 18/12 (2006.01); C08G 18/22 (2006.01); C08G 18/32 (2006.01); C08G 18/48 (2006.01); C08G 18/69 (2006.01); C08G 18/79 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01); C08K 9/06 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
C08G 18/12 (2013.01); C08G 18/227 (2013.01); C08G 18/3206 (2013.01); C08G 18/4841 (2013.01); C08G 18/698 (2013.01); C08G 18/797 (2013.01); C08G 18/798 (2013.01); C08K 3/346 (2013.01); C08K 3/36 (2013.01); C08K 9/06 (2013.01); C09J 5/06 (2013.01); C09J 175/08 (2013.01); C09J 2301/312 (2020.08);
Abstract

Disclosed are curable compositions containing isocyanate functional prepolymer containing two part adhesives wherein the prepolymers contain in their backbones hydrophobic segments and the curative part comprises one or more oligomeric or polymeric compounds having more than one isocyanate reactive groups; and one or more low molecular weight compounds having more than one isocyanate reactive groups wherein the low molecular weight compounds and the amount of such low molecular weight compounds are selected to such that the composition after full cure exhibits a ratio of modulus (e.g., Young's modulus or shear storage modulus) measured at −35° C. to the modulus measured at 23° C. of less than 10. The cured compositions exhibit higher stiffness across the common use temperature range and improved hydrolytic stability especially when exposed to elevated temperatures. Also disclosed are methods of bonding substrates together utilizing such compositions.


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