The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Nov. 19, 2020
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Narito Kaji, Aira, JP;

Yosuke Iwamoto, Kirishima, JP;

Ryohei Matsubara, Kirishima, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01); B41J 2/345 (2006.01);
U.S. Cl.
CPC ...
B41J 2/335 (2013.01); B41J 2/345 (2013.01);
Abstract

A thermal head includes a head base, a wiring board, a plurality of recessed portions, a contact portion, a plurality of drive ICs, a plurality of wire members, and a resin member. The head base includes a substrate. The wiring board is located adjacent to the head base. The plurality of recessed portions are located adjacent to the head base. The contact portion is located between the recessed portions adjacent to each other, and the substrate and the wiring board are in contact with each other at the contact portion. The plurality of drive ICs are located on the first surface of the wiring board so as to face one by one the plurality of recessed portions. The plurality of wire members are located across the recessed portions and electrically connect the substrate and the drive ICs. The resin member seals the plurality of wire members and the plurality of drive ICs.


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