The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Apr. 28, 2017
Applicant:

Showa Denko Packaging Co., Ltd., Kanagawa, JP;

Inventors:

Wei He, Kanagawa, JP;

Terutoshi Kumaki, Kanagawa, JP;

Makoto Karatsu, Kanagawa, JP;

Takashi Nagaoka, Kanagawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 7/12 (2006.01); H01G 11/18 (2013.01); H01G 11/78 (2013.01); H01M 10/0525 (2010.01); H01M 50/124 (2021.01); H01M 50/129 (2021.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/103 (2021.01); H01M 50/145 (2021.01); H01M 50/133 (2021.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 7/12 (2013.01); H01G 11/18 (2013.01); H01G 11/78 (2013.01); H01M 10/0525 (2013.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/124 (2021.01); H01M 50/129 (2021.01); B32B 2457/10 (2013.01); B32B 2457/16 (2013.01); H01M 50/103 (2021.01); H01M 50/133 (2021.01); H01M 50/145 (2021.01);
Abstract

Provided is a packaging material for a power storage device capable of securing excellent formability without causing pinholes and/or cracks even when deep depth forming is performed and also capable of sufficiently preventing delamination even when deep depth forming is performed or even when it is used under severe environments, such as, e.g., high temperature and high humidity. [Solving means] The packaging material for a power storage device has a configuration including a heat resistant resin layerserving as an outer layer, a heat fusible resin layerserving as an inner layer, and a metal foil layerdisposed between both the two layers. The heat resistant resin layeris composed of a heat resistant resin film with a hot water shrinkage percentage of 1.5% to 12%. The heat resistant resin layerand the metal foil layerare bonded via an outer adhesive layercomposed of a cured film of an electron beam curable resin composition.


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