The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Feb. 04, 2020
Applicant:

Safran Aircraft Engines, Paris, FR;

Inventors:

Vincent Joudon, Moissy-Cramayel, FR;

Damien Bruno Lamouche, Moissy-Cramayel, FR;

Matthieu Patrick Jean Roger Perlin, Moissy-Cramayel, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/04 (2006.01); B23P 6/00 (2006.01); B24C 1/10 (2006.01); B24C 5/00 (2006.01); B26F 3/06 (2006.01); B64C 11/20 (2006.01); F01D 5/00 (2006.01); F01D 5/28 (2006.01);
U.S. Cl.
CPC ...
B23P 19/04 (2013.01); B23P 6/002 (2013.01); B24C 1/10 (2013.01); B24C 5/005 (2013.01); B26F 3/06 (2013.01); B64C 11/205 (2013.01); F01D 5/005 (2013.01); F01D 5/288 (2013.01); F05D 2230/10 (2013.01);
Abstract

A method for separating a first mechanical part from a second mechanical part is described, wherein the second mechanical part is bonded to the first mechanical part by an adhesive film along a connecting area, the first mechanical part having a first specific thermal conductivity and the second mechanical part having a second thermal conductivity that is higher than the first thermal conductivity. The method includes at least one cooling step during which the second mechanical part is cooled to a negative temperature and at least one stressing step during which the second mechanical part is subjected to mechanical stress in order to cause the adhesive film to break.


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