The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2023
Filed:
Dec. 20, 2022
Applicant:
Eagle Technology, Llc, Melbourne, FL (US);
Inventors:
Michael T. De Roy, Melbourne, FL (US);
Phillip K. Nickel, Palm Bay, FL (US);
Jay S. Nelson, Palm Bay, FL (US);
Andres M. Gonzalez, Melbourne, FL (US);
William A. Marquart, Melbourne, FL (US);
Assignee:
EAGLE TECHNOLOGY, LLC, Melbourne, FL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); B23K 3/06 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0623 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/3735 (2013.01); H01L 23/49822 (2013.01); H05K 3/3468 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15312 (2013.01);
Abstract
Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.