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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11731200 B1

PDFFull Text
Date of Patent:
Aug. 22, 2023

Filed:

Sep. 17, 2020

Cooling device with processing head of a lamination molding apparatus

Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventors:

Shuji Okazaki, Kanagawa, JP;

Naoto Nakamura, Kanagawa, JP;

Shuichi Kawada, Kanagawa, JP;

Assignee:

Sodick Co., Ltd., Kanagawa, JP;

Attorney:

JCIPRNET

Primary Examiner:

Xiao S Zhao

Assistant Examiner:

Nicholas J Chidiac

Int. Cl.
CPC ...
B22F 10/28 (2021.01); B22F 10/38 (2021.01); B22F 10/50 (2021.01); B22F 12/00 (2021.01); B22F 12/13 (2021.01); B22F 12/20 (2021.01); B22F 12/41 (2021.01); B22F 12/44 (2021.01); B22F 12/70 (2021.01); B22F 12/90 (2021.01); B22F 3/10 (2006.01); B23K 37/00 (2006.01); B33Y 30/00 (2015.01); B22F 10/00 (2021.01); B22F 10/32 (2021.01); B33Y 40/00 (2020.01); B22F 10/77 (2021.01);
U.S. Cl.
CPC ...
B22F 10/28 (2021.01); B22F 3/1007 (2013.01); B22F 3/1028 (2013.01); B22F 10/00 (2021.01); B22F 10/32 (2021.01); B22F 10/38 (2021.01); B22F 12/20 (2021.01); B22F 12/224 (2021.01); B22F 12/90 (2021.01); B23K 37/003 (2013.01); B33Y 40/00 (2014.12); B22F 10/50 (2021.01); B22F 10/77 (2021.01); B22F 12/13 (2021.01); B22F 12/41 (2021.01); B22F 12/44 (2021.01); B22F 12/70 (2021.01); B33Y 30/00 (2014.12);
Abstract

The lamination molding apparatus includes an irradiator, a processing device, a cooling device, and an inert gas supply source. The irradiator irradiates a laser beam or an electron beam to a material layer to form a solidified layer. The processing device includes a processing head for holding a tool, and a processing head driver for moving the processing head in at least a horizontal direction. The cooling device is arranged in the processing head and cools a solidified body formed by laminating the solidified layers to a cooling temperature. The cooling device includes a cold gas discharger having a cold gas discharge port for discharging a cold gas being an inert gas having a temperature equal to or lower than the cooling temperature, and discharging the cold gas toward the solidified body. The inert gas supply source supplies the inert gas to the cold gas discharger.

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