The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Oct. 10, 2019
Applicant:
Bose Corporation, Framingham, MA (US);
Inventor:
Mark A. Hayner, Belmont, MA (US);
Assignee:
Bose Corporation, Framingham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); H04R 9/06 (2006.01); H04R 7/16 (2006.01); H04R 7/06 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H04R 31/003 (2013.01); B81C 1/00182 (2013.01); H04R 7/06 (2013.01); H04R 7/16 (2013.01); H04R 9/06 (2013.01); H04R 2231/003 (2013.01);
Abstract
A semiconductor wafer has formed within it a plurality of piston tops of equal area. Each of the piston tops includes a thin flat region from which a majority of the thickness of the original semiconductor wafer may have been removed. A first one of the piston tops has a lower thickness than a second one of the piston tops. The second piston top has at least one hole in it, the volume of the hole corresponding to the difference in thickness between the first and second piston tops, such that the masses of the first and second piston tops differ by less than the variation in thickness between them.