The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Apr. 12, 2022
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Hideyuki Fujimoto, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02355 (2021.01); H01S 5/024 (2006.01); H01S 5/02345 (2021.01); H01S 5/02212 (2021.01); H01S 5/02255 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02355 (2021.01); H01S 5/02345 (2021.01); H01S 5/02469 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49111 (2013.01); H01S 5/02212 (2013.01); H01S 5/02255 (2021.01);
Abstract

A semiconductor laser device includes: a housing including: a first upper upward-facing surface, a second upper upward-facing surface, a mounting surface, inner lateral surfaces, a first wiring part disposed on the first upper upward-facing surface, and a second wiring part disposed on the second upper upward-facing surface; a submount including: a first main surface fixed to the mounting surface of the housing, and a second main surface opposite to the first main surface; a semiconductor laser element fixed to the second main surface of the submount; a first wire connected to the first wiring part for electrical connection of the semiconductor laser element; and a second wire connected to the second wiring part for electrical connection of the semiconductor laser element.


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