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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11728319 B1

PDFFull Text
Date of Patent:
Aug. 15, 2023

Filed:

Mar. 11, 2021

Semiconductor package including a substrate, a semiconductor device, and a mold

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Sang-Won Lee, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD, Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Caleb E Henry

Assistant Examiner:

Dilinh P Nguyen

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 25/18 (2013.01); H01L 23/295 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19106 (2013.01);
Abstract

A semiconductor package includes a first sub-semiconductor package, an interposer substrate, and a second sub-semiconductor package that are sequentially stacked. The first sub-semiconductor package includes a first package substrate, a first semiconductor device, and a first mold member that are sequentially stacked, and the interposer substrate includes at least one hole. The first mold member includes: a mold main portion which covers the first semiconductor device; a mold connecting portion extended from the mold main portion and inserted into the at least one hole; and a mold protruding portion extended from the mold connecting portion to cover a top surface of the interposer substrate outside the at least one hole. The mold main portion, the mold connecting portion, and the mold protruding portion constitute a single object.

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