The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Jul. 23, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ajou University Industry—academic Cooperation Foundation, Suwon-si, KR;
Youngjae Kang, Suwon-si, KR;
SangWoon Lee, Suwon-si, KR;
Joungeun Yoo, Seongnam-si, KR;
Duseop Yoon, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION, Gyeonggi-do, KR;
Abstract
A semiconductor interconnect and an electrode for semiconductor devices may include a thin film including a multielement compound represented by Formula 1 and having a thickness equal to or less than about 50 nm, a grain size (A) to thickness (B) ratio (A/B) equal to or greater than about 1.2, and a resistivity equal to or less than about 200 μΩ·cm:MAX  Formula 1 In Formula 1, M, A, X, and n are as described in the specification.