The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Nov. 05, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventor:

Dietrich Bonart, Bad Abbach, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/3114 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 23/544 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54473 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06527 (2013.01);
Abstract

A semiconductor chip includes a mounting surface having a plurality of first conductive contacts and a second conductive contact, wherein each of the first contacts in the plurality is arranged in a regularly spaced apart array such that centroids of immediately adjacent ones of the first contacts are separated from one another in a first direction by a first distance, each of the first contacts in the plurality have an identical first lateral extent, and the second conductive contact is arranged between two of the first conductive contacts in the first direction such that first and second distances between the at least one second conductive contact and the two of the first conductive contacts are each less than the first distance.


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