The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Aug. 02, 2021
Applicants:

National Technology & Engineering Solutions of Sandia, Llc, Albuquerque, NM (US);

The Texas A&m University System, College Station, TX (US);

Inventors:

Michael Wood, Albuquerque, NM (US);

Alejandro J. Grine, Albuquerque, NM (US);

Darwin K. Serkland, Albuquerque, NM (US);

Bryan James Kaehr, Albuquerque, NM (US);

Andrew E. Hollowell, Albuquerque, NM (US);

Gregory M. Peake, Albuquerque, NM (US);

Alexander Ruyack, Albuquerque, NM (US);

Sam Palermo, College Station, TX (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/43 (2006.01); H04B 10/40 (2013.01); G02B 6/293 (2006.01); H04B 10/50 (2013.01);
U.S. Cl.
CPC ...
G02B 6/4215 (2013.01); G02B 6/2934 (2013.01); G02B 6/4249 (2013.01); G02B 6/4295 (2013.01); G02B 6/43 (2013.01); H04B 10/40 (2013.01); H04B 10/503 (2013.01); B81B 2201/045 (2013.01);
Abstract

A photonics transceiver is described herein, wherein the photonics transceiver exhibits improved areal bandwidth density and improved energy per bit consumption relative to conventional photonics transceivers. The photonics transceiver achieves an areal bandwidth density of at least 5 Tbps/mmwith an energy consumption of less than 500 fJ/bit (sum of energy consumed for both a transmitted bit and a received bit). The photonics transceiver is a multi-chip module, where chips in the multi-chip module are tightly integrated with one another. The multi-chip module includes light source, photodetector, photonics, and control/logic chips. The photonics chip includes transparent conducting oxide integrated optical modulators and multiplexers and demultiplexers based on MEMS-tunable optical ring resonators.


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