The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Nov. 01, 2021
Applicant:
Wavefront Research, Inc., Northampton, PA (US);
Inventors:
Randall C. Veitch, Nazareth, PA (US);
Thomas W. Stone, Hellertown, PA (US);
Assignee:
Wavefront Research, Inc., Northampton, PA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
G02B 6/4212 (2013.01); G02B 6/4204 (2013.01); G02B 6/4239 (2013.01); G02B 6/4244 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H01L 31/02327 (2013.01); H05K 3/284 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10143 (2013.01); Y02P 70/50 (2015.11); Y10T 29/49002 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/49144 (2015.01);
Abstract
Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.