The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Dec. 16, 2021
Denselight Semiconductors Pte Ltd, Singapore, SG;
Yee Loy Lam, Singapore, SG;
Ter Hoe Loh, Singapore, SG;
Kamal Kader, Singapore, SG;
Long Cheng Koh, Singapore, SG;
DENSELIGHT SEMICONDUCTORS PTE LTD, Singapore, SG;
Abstract
A photonic integrated chip is configured as a transmitter-receiver chip. The photonic integrated chip includes a light emitter, a light detector, a multi-mode interference coupler, and a mode-filed adapter. The light emitted by the light emitter is guided to a core layer formed below the multi-mode interference coupler, and further to the mode-filed adapter for transmission of light to an optical fiber coupled with the photonic integrated chip. Similarly, light received by the mode-filed adapter from the optical fiber propagates to the core layer, and is guided by the multi-mode interference coupler into the light detector. The photonic integrated chip is utilized to realize a single-unit transmitter-receiver module for a fiber optic gyroscope circuit based on monolithic integration of photonics components via wafer fabrication on a substrate. The photonic integrated chip has a low fabrication cost, low size, and is robust.