The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Dec. 19, 2019
Applicant:

Baker Hughes Oilfield Operations Llc, Houston, TX (US);

Inventors:

Neil Geoffrey Harris, Farnborough, GB;

James David Ratcliffe, Farnborough, GB;

Timothy Michael Gill, Farnborough, GB;

Enrico Fiori, Houston, TX (US);

Christopher Hamblin, Houston, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 17/10 (2006.01); G01V 8/02 (2006.01); E21B 47/01 (2012.01); E21B 47/113 (2012.01); E21B 47/135 (2012.01); G01V 8/16 (2006.01); G01V 8/10 (2006.01);
U.S. Cl.
CPC ...
E21B 17/1014 (2013.01); E21B 47/01 (2013.01); E21B 47/114 (2020.05); E21B 47/135 (2020.05); G01V 8/02 (2013.01); G01V 8/10 (2013.01); G01V 8/16 (2013.01);
Abstract

A sensor device includes a tubular body having a first end and a second end opposite the first end, a pressure plug on the first end of the tubular body, and a sensor tip on the second end of the tubular body, wherein the sensor tip comprises an open end opposite the tubular body and an optical tip removably positioned through the open end and held in place by a removable cap. The optical tip includes an optical rod and a rod holder. The sensor device further includes an optical fiber extending from the pressure plug, through the tubular body, and into the sensor tip where the optical fiber is optically coupled to the optical rod. The pressure plug may include a slack cavity where the optical fiber is in slack under neutral temperature and pressure conditions to withstand expansion of the sensor device under high temperature or pressure conditions.


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