The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Oct. 21, 2019
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Keith Daniel Humfeld, Federal Way, WA (US);

Joseph Andrew Bolton, Newalla, OK (US);

Assignee:

THE BOEING COMPANY, Arlington, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B64F 5/00 (2017.01); B29C 70/00 (2006.01); B64F 5/10 (2017.01); B29C 70/54 (2006.01); B64C 3/26 (2006.01); B23K 101/00 (2006.01); B29K 63/00 (2006.01); B29K 307/04 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B64F 5/10 (2017.01); B29C 70/545 (2013.01); B64C 3/26 (2013.01); B23K 2101/006 (2018.08); B29C 2793/0009 (2013.01); B29K 2063/00 (2013.01); B29K 2307/04 (2013.01); B29L 2031/3085 (2013.01);
Abstract

Methods for machining a composite material substrate are discloses comprising integrating a predetermined pattern area having a disbond material for the purpose of creating a disbond region into the composite material substrate at a predetermined thickness, detecting the disbond region and forming a plurality of recesses in the composite material substrate by removing a machined plug from the composite material substrate to form recesses positioned at locations corresponding to the predetermined pattern area, and composite components comprising the recesses machined according to such methods.


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