The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Oct. 13, 2021
GM Global Technology Operations Llc, Detroit, MI (US);
Ftech R&d North America Inc., Troy, MI (US);
Balbir Singh Sangha, Ajax, CA;
Len V. Peschansky, West Bloomfield, MI (US);
Manish Pamwar, Whitby, CA;
Fred M. Marquardt, Commerce, MI (US);
William R. Rodgers, Bloomfield Township, MI (US);
Bruce N. Greve, Clarkston, MI (US);
David Kennedy, Farmington Hills, MI (US);
Adrian Bica, Markham, CA;
Bikramjit Sarkaria, Windsor, CA;
GM GLOBAL TECHNOLOGY OPERATIONS LLC, Detroit, MI (US);
Abstract
A chassis assembly having mixed material for reduced mass is provided. The assembly comprises an upper structure comprised of metal. The upper structure has a plurality of first bond surfaces, each of which is parallel with each other at varying elevations relative to a z-axis of a 3-dimensional coordinate thereof. The assembly further comprises a lower structure made of a polymer composite. The lower structure has a plurality of second bond surfaces, each of which is parallel with each other at varying elevations relative to the z-axis thereof. The second bond surfaces are arranged to align with the first bond surfaces in complementing relation such that the lower structure is joined with the upper structure at the first and second bond surfaces. The assembly further comprises an adhesive disposed between the first and second bond surfaces to join the lower and upper structures at the first and second bond surfaces, defining a bond gap between the first and second bond surfaces.