The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Sep. 30, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Justin H. Wong, Pleasanton, CA (US);

Kevin H. Song, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/015 (2012.01); B24B 37/10 (2012.01); B24B 57/02 (2006.01); B24B 37/013 (2012.01); B24B 49/12 (2006.01); B24B 37/20 (2012.01); B24B 37/32 (2012.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/015 (2013.01); B24B 37/105 (2013.01); B24B 37/205 (2013.01); B24B 49/12 (2013.01); B24B 57/02 (2013.01); B24B 37/32 (2013.01);
Abstract

A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid delivery arm and a second fluid delivery arm disposed over the polishing pad to dispense liquid, such as a polishing fluid or water. The first fluid delivery arm is disposed over at least 50% of the radius of the polishing pad, while the second fluid delivery arm is disposed over less than 50% of the radius of the polishing pad. The second fluid delivery arm is configured to dispense either a polishing fluid or a water onto the polishing pad to effect the polishing rate at the edge of the substrate.


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