The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Sep. 02, 2020
Applicant:

Sentient Science Corporation, Buffalo, NY (US);

Inventors:

Jingfu Liu, Prior Lake, MN (US);

Behrooz Jalalahmadi, Long Island City, NY (US);

Ziye Liu, West Lafayette, IN (US);

Andrew Vechart, Minnetrista, MN (US);

Xiawa Wu, Erie, PA (US);

Assignee:

Sentient Science Corporation, Buffalo, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/85 (2021.01); G01N 21/88 (2006.01); B23K 26/342 (2014.01); G06T 7/00 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B23K 26/00 (2014.01); B22F 10/28 (2021.01);
U.S. Cl.
CPC ...
B22F 10/85 (2021.01); B22F 10/28 (2021.01); B23K 26/0093 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); G01N 21/8851 (2013.01); G06T 7/001 (2013.01); G06T 2207/10048 (2013.01); G06T 2207/30136 (2013.01);
Abstract

A system and method of additive manufacturing is disclosed herein which when run or performed form a product with a powder-based additive manufacturing device by adding sequential layers of material on top of one another. As each sequential layer of material is added, the system and method can include monitoring the sequential layer with a defect analysis subsystem to detect whether the sequential layer has any defects. For a detected defect, it can be determined whether defect correction is required. For a required defect correction, one or more correction parameters for the required defect correction can be identified; and a correction command including the one or more correction parameters can be sent to the additive manufacturing device, the correction command causing the additive manufacturing device to help correct the detected defect in the sequential layer according to the correction parameters prior to moving on to a next sequential layer.


Find Patent Forward Citations

Liu, Jingfu. (2023). Systems and methods for defect detection and correction in additive manufacturing processes (U.S. Patent No. 11724315). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11724315

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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