The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Jul. 15, 2021
Applicant:

Toyo Seikan Group Holdings, Ltd., Tokyo, JP;

Inventors:

Toshihiko Miyazaki, Osaka, JP;

Hirohisa Masuda, Osaka, JP;

Hiroshi Shimomura, Osaka, JP;

Kouji Nanbu, Kudamatsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 77/10 (2023.01); C03C 3/066 (2006.01); C03C 3/068 (2006.01); C03C 3/14 (2006.01); H10K 50/828 (2023.01); H10K 71/00 (2023.01); C03C 8/04 (2006.01); C03C 8/16 (2006.01); H10K 30/80 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 77/111 (2023.02); C03C 3/066 (2013.01); C03C 3/068 (2013.01); C03C 3/14 (2013.01); C03C 8/04 (2013.01); C03C 8/16 (2013.01); H10K 50/828 (2023.02); H10K 71/00 (2023.02); C03C 2207/00 (2013.01); H10K 30/80 (2023.02); H10K 2102/00 (2023.02); H10K 2102/311 (2023.02); H10K 2102/351 (2023.02); Y10T 428/12618 (2015.01);
Abstract

A substrate for flexible device. The substrate has a nickel-plated metal sheet having a nickel-plating layer formed on at least one surface of a metal sheet or a nickel-based sheet, and a glass layer of an electrically-insulating layered bismuth-based glass on a surface of the nickel-plating layer or the nickel-based sheet. An oxide layer having a roughened surface is formed on the surface of the nickel-plating layer or the surface of the nickel-based sheet, and the bismuth-based glass contains 70 to 84% by weight of BiO, 10 to 12% by weight of ZnO, and 6 to 12% by weight of BO. Also disclosed is a method for producing the substrate for flexible device, a substrate for an organic EL device, a sheet used as a substrate for flexible device, a method for producing the sheet and a bismuth-based lead-free glass composition.


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