The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Aug. 31, 2021
Applicant:
Auras Technology Co., Ltd., New Taipei, TW;
Inventors:
Assignee:
AURAS TECHNOLOGY CO., LTD., New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B23K 31/02 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); F28F 9/18 (2006.01); B23K 101/14 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); B23K 31/02 (2013.01); F28D 15/0233 (2013.01); F28D 15/046 (2013.01); F28F 9/18 (2013.01); H05K 7/2039 (2013.01); H05K 7/20263 (2013.01); H05K 7/20336 (2013.01); B23K 2101/14 (2018.08); F28F 2230/00 (2013.01); F28F 2245/00 (2013.01); F28F 2275/062 (2013.01); G06F 1/20 (2013.01);
Abstract
A liquid cooling head manufacturing method includes the following steps. First, a liquid channel main body is provided. Then, a heat dissipation bottom plate and a heat sink are disposed in different recessed indentations in the liquid channel main body. The heat dissipation bottom plate and the heat sink are welded in the liquid channel main body and a cover plate is sealed on the liquid channel main body.