The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Apr. 27, 2022
Applicant:

Avago Technologies International Sales Pte. Limited, Singapore, SG;

Inventors:

Chang Kyu Choi, Fremont, CA (US);

Hyun Mo Ku, Seoul, KR;

Sarah Kay Haney, San Jose, CA (US);

Li Sun, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H05K 2201/0364 (2013.01); H05K 2201/062 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10318 (2013.01);
Abstract

A system and method for dissipating heat from a package and reducing interference between signaling pins is disclosed. The system includes a circuit substrate that includes a dielectric layer and at least one metal layer having an external surface. A plurality of metal posts is disposed on the external surface that function to a least one of dissipate heat from the circuit substrate, shield interfering signals between the signaling pins, and interact with mounting substrates on corresponding componentry. One or more metal posts are merged, increasing the interference shielding and heat dissipation functions of the metal posts.


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