The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Mar. 17, 2021
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Takashi Tsubakidani, Tokyo, JP;
Kosuke Yamaguchi, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H03K 17/687 (2006.01); H01L 25/18 (2023.01); H03K 17/0812 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 25/18 (2013.01); H03K 17/08122 (2013.01); H03K 17/687 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/2908 (2013.01); H01L 2225/06503 (2013.01);
Abstract
A second semiconductor switching element is connected in series with a first semiconductor switching element, and is at least partially stacked on the first semiconductor switching element in the thickness direction. A first control element controls the first semiconductor switching element and the second semiconductor switching element, and performs an overcurrent protection operation with reference to a shunt voltage. The first control element is arranged outside the first semiconductor switching element and the second semiconductor switching element in the in-plane direction.