The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Dec. 18, 2020
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventor:
Oliver Blank, Villach, AT;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01);
Abstract
A semiconductor wafer has a semiconductor body, an insulation layer on the semiconductor body, a scribeline region designated to be subjected to a wafer separation processing stage, and an optically detectable reference feature laterally spaced inward from the scribeline region and configured to serve as a reference position during the wafer separation processing stage. A corresponding method of processing the semiconductor wafer, a power semiconductor die and a semiconductor wafer separation apparatus are also described.