The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Jul. 12, 2021
Applicants:
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Inventors:
Assignees:
HYUNDAI MOTOR COMPANY, Seoul, KR;
KIA CORPORATION, Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/047 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/495 (2013.01); H01L 23/047 (2013.01); H01L 23/498 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/2612 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73251 (2013.01); H01L 2924/30107 (2013.01);
Abstract
A power module includes a power semiconductor device, a first power lead electrically connected to a first power terminal of the power semiconductor device, a second power lead disposed in parallel to the first power lead near the first power lead and electrically connected to a second power terminal of the power semiconductor device, and a conductive plate disposed to be spaced apart from the first power lead or the second power lead by a predetermined distance such that a region overlapping with the first power lead or the second power lead is formed.