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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11721571 B1

PDFFull Text
Date of Patent:
Aug. 08, 2023

Filed:

Oct. 14, 2021

Loop height measurement of overlapping bond wires

Applicant:

Emage Equipment Pte. Ltd., Singapore, SG;

Inventors:

Soon Wei Wong, Singapore, SG;

Victor Vertoprakhov, Novosibirsk, RU;

Assignee:

EMAGE VISION PTE. LTD., Singapore, SG;

Attorney:

Thomas Horstemeyer, LLP

Primary Examiner:

Mohammed Jebari

Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01N 21/95 (2006.01); G06T 7/60 (2017.01); G06T 11/20 (2006.01); H04N 23/56 (2023.01); H04N 23/695 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); G01N 21/9501 (2013.01); G06T 7/60 (2013.01); G06T 11/206 (2013.01); H04N 23/56 (2023.01); H04N 23/695 (2023.01); G06T 2207/20072 (2013.01); G06T 2207/30148 (2013.01); H01L 24/49 (2013.01); H01L 2224/4917 (2013.01);
Abstract

An apparatus and method for measuring loop height of overlapping bonded wires, interconnecting the pads of a single or stacked silicon chips to the pads of a substrate taking the steps of: focussing of an optical assembly at multiple points of the bond wire including overlapping bond wires, capturing an image of the bond wire at each of the predetermined focused points; calculating the height of each point of the wire with respect to a reference plane; and tabulating the height data using the X, Y and Z coordinates.

Find Patent Forward Citations

Wong, Soon. (2023). Loop height measurement of overlapping bond wires (U.S. Patent No. 11721571). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11721571

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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