The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Oct. 01, 2020
Applicant:

Fujifilm Electronic Materials U.s.a., Inc., N. Kingstown, RI (US);

Inventors:

Raj Sakamuri, Sharon, MA (US);

Ognian Dimov, Warwick, RI (US);

Sanjay Malik, Attleboro, MA (US);

Michaela Connell, Cumberland, RI (US);

Ahmad A. Naiini, East Greenwich, RI (US);

Stephanie Dilocker, Attleboro, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C08L 79/08 (2006.01); H01L 33/54 (2010.01); H01L 31/048 (2014.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02109 (2013.01); C08L 79/08 (2013.01); H01L 23/293 (2013.01); H01L 31/0481 (2013.01); H01L 33/54 (2013.01); C08L 2203/16 (2013.01);
Abstract

This disclosure describes a process of generating a planarizing polyimide based dielectric film on a substrate with conducting metal pattern, wherein the process comprised steps of: (a) providing a dielectric film forming composition comprising at least one fully imidized polyimide polymer and at least one solvent; and (b) depositing the dielectric film forming composition onto a substrate with conducting metal pattern to form a dielectric film, wherein the difference in the highest and lowest points on a top surface of the dielectric film is less than about 2 microns.


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