The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Jan. 08, 2021
Taiyo Yuden Co., Ltd., Tokyo, JP;
Shota Tanaka, Tokyo, JP;
Joji Kobayashi, Tokyo, JP;
TAIYO YUDEN CO., LTD., Tokyo, JP;
Abstract
A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces facing each other in a direction of a second axis orthogonal to the first axis, the internal electrodes being exposed from the first and second side surfaces; thermocompression-bonding a first side margin sheet to the first side surface; forming a first side margin by punching the thermocompression-bonded first side margin sheet with the first side surface; thermocompression-bonding a second side margin sheet to the second side surface, the second side margin sheet including a bonding surface having a higher flexibility than the first side margin formed on the first side surface; and forming a second side margin by punching the thermocompression-bonded second side margin sheet with the second side surface.