The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Jul. 31, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Takashi Sawada, Nagaokakyo, JP;

Kenichi Togo, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1209 (2013.01); H01G 4/008 (2013.01); H01G 4/224 (2013.01);
Abstract

A method of producing a ceramic electronic component includes baking a first electrode paste containing a metal powder at a first temperature to form a first electrode layer at a first region of a ceramic body, baking a second electrode paste containing a metal powder of the same type as the metal powder in the first electrode paste at a second temperature lower than the first temperature to form a second electrode layer at a second region different from the first region of the ceramic body, and applying a physical shock treatment to a surface of the second electrode layer to densify a surface layer portion of the second electrode layer.


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