The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Jun. 09, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd.;

Inventors:

Sang Yeop Kim, Suwon-si, KR;

Beom Joon Cho, Suwon-si, KR;

Gyeong Ju Song, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/012 (2013.01); H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/1209 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01);
Abstract

An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A≤B≤0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.


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