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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11720023 B1

PDFFull Text
Date of Patent:
Aug. 08, 2023

Filed:

Nov. 04, 2020

Material for forming organic film, method for forming organic film, patterning process, and compound

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Kori, Joetsu, JP;

Takayoshi Nakahara, Joetsu, JP;

Yusuke Biyajima, Joetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Caleen O Sullivan

Int. Cl.
CPC ...
G03F 7/11 (2006.01); C07D 209/48 (2006.01); C07D 403/14 (2006.01); C07D 487/04 (2006.01); C08F 26/06 (2006.01); C09D 139/04 (2006.01); G03F 7/09 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C07D 209/48 (2013.01); C07D 403/14 (2013.01); C07D 487/04 (2013.01); C08F 26/06 (2013.01); C09D 139/04 (2013.01); G03F 7/094 (2013.01); H01L 21/0273 (2013.01); H01L 21/0337 (2013.01); H01L 21/76819 (2013.01);
Abstract

The present invention provides a material for forming an organic film, containing a compound shown by the following general formula (1), and an organic solvent, where X represents an organic group having a valency of n1 and 2 to 50 carbon atoms, n1 represents an integer of 1 to 10, and Rrepresents at least one or more of the following general formulae (2) to (4). This aims to provide an organic film material for forming an organic film that has all of high filling property, high planarizing property, and excellent adhesive force to a substrate.

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Kori, Daisuke. (2023). Material for forming organic film, method for forming organic film, patterning process, and compound (U.S. Patent No. 11720023). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11720023

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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