The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Mar. 03, 2021
Applicant:

Marvell Asia Pte Ltd., Singapore, SG;

Inventors:

Radhakrishnan L. Nagarajan, San Jose, CA (US);

Mark Patterson, San Jose, CA (US);

Assignee:

Marvell Asia Pte Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/43 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/43 (2013.01); G02B 6/426 (2013.01); G02B 6/4214 (2013.01); G02B 6/4246 (2013.01); G02B 6/4257 (2013.01); G02B 6/4261 (2013.01);
Abstract

An assembled electro-optical switch module includes a package substrate. Four optical socket members are disposed respectively to the package substrate. Each optical socket member includes four sockets closely packed in a row. Each socket has a recessed flat region with topside land grid array (LGA) interposer connected to bottom side solder bumps and a side notch opening aligned to an edge of the package substrate at the corresponding edge region. Sixteen optical modules in four sets are co-packaged in the package substrate. Each set has four optical modules respectively seated in the four sockets of each optical socket member with top side LGA interposer. Four clamp latch members are applied to clamp each of the four sets of optical modules in respective optical socket members. A data processor device with 51.2 Tbps data interface is disposed to the package substrate and electrically coupled to each of the sixteen optical modules.


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