The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Mar. 01, 2021
Applicant:
Treadstone Technologies, Inc., Princeton, NJ (US);
Inventors:
Conghua Wang, West Windsor, NJ (US);
Yong Tao, Peoria, IL (US);
Lin Zhang, Burlingame, CA (US);
Gerald A. Gontarz, Spotswood, NJ (US);
Assignee:
TREADSTONE TECHNOLOGIES, INC., Princeton, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/32 (2006.01); C23C 4/02 (2006.01); C23C 4/08 (2016.01); C23C 8/10 (2006.01); C23C 14/16 (2006.01); C23C 28/00 (2006.01); C23F 1/26 (2006.01); C25B 15/00 (2006.01); H01G 9/055 (2006.01); H01G 11/70 (2013.01); H01M 8/0206 (2016.01); H01M 8/0208 (2016.01); H01M 8/0228 (2016.01); C21D 6/00 (2006.01); C21D 9/00 (2006.01); C22C 14/00 (2006.01); C22F 1/18 (2006.01); C23C 4/12 (2016.01); C23C 14/02 (2006.01); C23C 14/35 (2006.01); C23F 1/28 (2006.01); C23F 17/00 (2006.01); H01M 8/021 (2016.01); H01M 8/1018 (2016.01); H01M 4/66 (2006.01); H01M 8/10 (2016.01);
U.S. Cl.
CPC ...
C23C 14/325 (2013.01); C21D 6/002 (2013.01); C21D 9/0068 (2013.01); C22C 14/00 (2013.01); C22F 1/183 (2013.01); C23C 4/02 (2013.01); C23C 4/08 (2013.01); C23C 4/12 (2013.01); C23C 8/10 (2013.01); C23C 14/02 (2013.01); C23C 14/021 (2013.01); C23C 14/16 (2013.01); C23C 14/165 (2013.01); C23C 14/35 (2013.01); C23C 28/321 (2013.01); C23C 28/345 (2013.01); C23F 1/26 (2013.01); C23F 1/28 (2013.01); C23F 17/00 (2013.01); C25B 15/00 (2013.01); H01G 9/055 (2013.01); H01G 11/70 (2013.01); H01M 8/021 (2013.01); H01M 8/0206 (2013.01); H01M 8/0208 (2013.01); H01M 8/0228 (2013.01); H01M 8/1018 (2013.01); H01M 4/661 (2013.01); H01M 4/662 (2013.01); H01M 4/667 (2013.01); H01M 2008/1095 (2013.01); Y02E 60/13 (2013.01);
Abstract
Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cmand 5 billion cm.