The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Jul. 09, 2019
Applicant:

Grirem Advanced Materials Co., Ltd, Beijing, CN;

Inventors:

Ronghui Liu, Beijing, CN;

Yuanhong Liu, Beijing, CN;

Xiaoxia Chen, Beijing, CN;

Xiaole Ma, Beijing, CN;

Yuan Xue, Beijing, CN;

Tongyu Gao, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 11/77 (2006.01); H01L 33/26 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
C09K 11/7734 (2013.01); C09K 11/7792 (2013.01); H01L 33/26 (2013.01); H01L 33/502 (2013.01);
Abstract

The present invention discloses a red light and near-infrared light-emitting material and a light-emitting device. The red light and near-infrared light-emitting material contains a compound represented by a molecular formula, xAO·yInO·bRO, wherein the element A is Sc and/or Ga; the element R is one or two of Cr, Yb, Nd or Er and necessarily includes Cr; and 0.001≤x≤1, 0.001≤y≤1, 0.001≤b≤0.2, and 0.001≤b/(x+y)≤0.2. The light-emitting material can be excited by a technically mature blue light source to emit light with a high-intensity wide-spectrum or multiple spectra. Compared with existing materials, the light-emitting material has higher luminescent intensity. The light-emitting device uses an LED chip to combine an infrared light-emitting material and a visible light light-emitting material. In this way, the same LED chip can emit near-infrared light and visible light at the same time, which greatly simplifies the packaging process and reduces the packaging cost.


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