The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Jul. 12, 2019
Applicant:
Nagase Chemtex Corporation, Osaka, JP;
Inventors:
Takayuki Hashimoto, Tatsuno, JP;
Eiichi Nomura, Tatsuno, JP;
Katsushi Kan, Tatsuno, JP;
Daisuke Mori, Tatsuno, JP;
Yosuke Oi, Tatsuno, JP;
Yukio Yada, Tatsuno, JP;
Takashi Hiraoka, Tatsuno, JP;
Takeyuki Kitagawa, Tatsuno, JP;
Assignee:
NAGASE CHEMTEX CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); C09J 7/35 (2018.01); C09J 7/10 (2018.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); C09J 11/04 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); B32B 9/005 (2013.01); B32B 9/045 (2013.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); C09J 7/10 (2018.01); C09J 11/04 (2013.01); H01L 23/295 (2013.01); B32B 2264/1021 (2020.08); B32B 2270/00 (2013.01); B32B 2457/14 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/00 (2013.01); C09J 2483/00 (2013.01);
Abstract
A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.