The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Jun. 29, 2021
Applicant:

Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, CN;

Inventors:

Rongtao Wang, Kunshan, CN;

Ningning Jia, Kunshan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); C08J 5/24 (2006.01); B32B 5/02 (2006.01); B32B 15/20 (2006.01); B32B 15/14 (2006.01); B32B 5/26 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); B32B 5/02 (2013.01); B32B 5/26 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08J 5/244 (2021.05); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/204 (2013.01); C08J 2371/12 (2013.01); C08J 2447/00 (2013.01); C08J 2453/02 (2013.01);
Abstract

A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.


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