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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11718750 B1

PDFFull Text
Date of Patent:
Aug. 08, 2023

Filed:

Dec. 05, 2018

Thermoplastic resin composition for laser direct structuring process, and molded product comprising same

Applicant:

Lotte Chemical Corporation, Seoul, KR;

Inventors:

Nam Hyun Kim, Uiwang-si, KR;

Jung Ki Kim, Uiwang-si, KR;

Sang Hyun Hong, Uiwang-si, KR;

Assignee:

Lotte Chemical Corporation, Seoul, KR;

Attorney:

Additon, Pendleton & Witherspoon, P.A.

Primary Examiner:

David J Buttner

Int. Cl.
CPC ...
C08L 69/00 (2006.01); C08L 67/02 (2006.01); C08K 3/32 (2006.01); C23C 18/28 (2006.01); C08G 63/183 (2006.01); C08G 77/448 (2006.01); C08L 51/04 (2006.01); C08L 83/04 (2006.01); C23C 18/16 (2006.01); H05K 1/03 (2006.01); C23C 18/20 (2006.01); C08G 64/18 (2006.01);
U.S. Cl.
CPC ...
C08L 69/00 (2013.01); C08G 63/183 (2013.01); C08G 77/448 (2013.01); C08K 3/32 (2013.01); C08L 51/04 (2013.01); C08L 67/02 (2013.01); C08L 83/04 (2013.01); C23C 18/1612 (2013.01); C23C 18/204 (2013.01); H05K 1/0373 (2013.01); C08G 64/186 (2013.01); C08K 2003/321 (2013.01); C08K 2003/328 (2013.01); C08L 2207/53 (2013.01);
Abstract

The present invention relates to a thermoplastic resin composition for laser direct structuring process, and a molded product comprising the same. In one specific embodiment, the thermoplastic resin composition comprises: approximately 100 parts by weight of a base resin; approximately 0.1-20 parts by weight of an additive for laser direct structuring; and approximately 1-20 parts by weight of an impact modifier, wherein the base resin comprises a polycarbonate resin, a polycarbonate-polysiloxane copolymer and a polyester resin.

Find Patent Forward Citations

Quick Actions:

Kim, Nam. (2023). Thermoplastic resin composition for laser direct structuring process, and molded product comprising same (U.S. Patent No. 11718750). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11718750

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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