The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Dec. 09, 2020
Applicant:
Microjet Technology Co., Ltd., Hsinchu, TW;
Inventors:
Hao-Jan Mou, Hsinchu, TW;
Ying-Lun Chang, Hsinchu, TW;
Hsien-Chung Tai, Hsinchu, TW;
Chi-Feng Huang, Hsinchu, TW;
Yung-Lung Han, Hsinchu, TW;
Wei-Ming Lee, Hsinchu, TW;
Assignee:
Microjet Technology Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14024 (2013.01); B41J 2/14072 (2013.01); B41J 2/14129 (2013.01); B41J 2/1601 (2013.01); B41J 2/1635 (2013.01); B41J 2202/11 (2013.01); B41J 2202/13 (2013.01);
Abstract
A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The at least one inkjet chip is directly formed on the chip substrate by the semiconductor process, and the wafer is diced into the at least one inkjet chip, to be implemented for inkjet printing.