The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Feb. 02, 2021
Apple Inc., Cupertino, CA (US);
Cheng P. Tan, Fremont, CA (US);
Sivesh Selvakumar, Sunnyvale, CA (US);
Jesse T. Dybenko, Santa Cruz, CA (US);
Enoch Mylabathula, Cupertino, CA (US);
Jason C. Sauers, Sunnyvale, CA (US);
Phil M. Hobson, Menlo Park, CA (US);
Laura M. Campo, Santa Clara, CA (US);
Dragos Moroianu, Cupertino, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.