The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Feb. 11, 2021
Applicant:
Knowles Electronics, Llc, Itasca, IL (US);
Inventors:
Vahid Naderyan, Itasca, IL (US);
Sung Lee, Itasca, IL (US);
Ankur Sharma, Itasca, IL (US);
Nick Wakefield, Itasca, IL (US);
Assignee:
KNOWLES ELECTRONICS, LLC, Itasca, IL (US);
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 7/06 (2006.01); H04R 7/18 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H04R 7/06 (2013.01); H04R 7/18 (2013.01); H04R 2201/003 (2013.01); H04R 2307/027 (2013.01);
Abstract
A MEMS die includes a substrate having an opening formed therein, a diaphragm having a first surface attached around a periphery thereof to the substrate and over the opening, and a backplate separated from a second surface of the diaphragm. The diaphragm includes at least one passage disposed between the first and second surfaces, and the at least one passage has a smaller cross-sectional area at the first surface than at the second surface.