The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2023

Filed:

Feb. 04, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Michael Lueders, Freising, DE;

Giacomo Calabrese, Freising, DE;

Nicola Bertoni, Freising, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 3/00 (2006.01); H04B 5/00 (2006.01); H01L 21/20 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/60 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 49/02 (2006.01); H05K 3/46 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H04B 5/005 (2013.01); H04B 5/0093 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 3/4673 (2013.01);
Abstract

A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.


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